Board-to-Board Receptacle for Dense Interconnects
The 87471-605LF: The surface-mount termination suits automated assembly, and the push-pull fastening type allows tool-less mating and unmating. Beryllium copper contacts with a 30 µinch gold mating finish provide consistent contact resistance over repeated mating cycles — a fit for industrial or telecom equipment where the board stack is accessed during service life.
Pitch, Positions, and Footprint Constraints
The row spacing is also 0.050" (1.27 mm), which sets the board footprint for the mating header — a 1.27 mm pitch header with matching row spacing is required.
Contact Metallurgy and Plating Strategy
Beryllium copper as the contact base material gives the beam a high elastic limit, resisting permanent set after deflection during mating.
Comparing the Tape-and-Reel Sibling
The 87471-605TRLF is electrically and mechanically identical — same 10 positions, 0.050" pitch, gold mating finish, and BeCu contacts. The only difference is packaging: the -605LF ships in a tube, while the -605TRLF is supplied on tape and reel with a pick-and-place feature for automated assembly. For high-volume reflow, the TR variant avoids tube-handling overhead.