Amphenol ICC Dubox™ board-to-board receptacle, 87606-335LF, 70 positions, 2 rows, 0.100" (2.54 mm) pitch, through-hole solder termination, gold mating contact finish, blue glass-filled thermoplastic housing, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | Dubox™ |
| Gender | Female Socket |
| Mounting type | Through Hole |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Blue |
| Insulation height | 0.335\" (8.51mm) |
| Insulation material | Thermoplastic, Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Termination | Solder |
| Applications | Automotive, General Purpose, Industrial, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 70 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.114\" (2.90mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
The 87606-335LF: The through-hole solder termination and 0.114" (2.90 mm) post length suit standard PCB thicknesses in mezzanine or backplane configurations.
At 70 positions across two rows, this receptacle fills a dense board-edge interconnect. The insulation height of 0.335" (8.51 mm) and post length of 0.114" (2.90 mm) define the mated stack height envelope.
87606-335LF is available to order against an RFQ. We source this active-production part from our multi-distributor network; current pricing and lead time are confirmed at quote time.
The mating pitch is 0.100" (2.54 mm) with an equal 0.100" row spacing, both standard for Dubox™ series board-to-board interconnects.
The part is listed as RoHS compliant per the manufacturer specification.