Board-to-Board Receptacle for 0.100" Header Grids
The 87606-409LF: The push-pull fastening and through-hole solder termination suit it for wire-to-board interconnects in automotive, industrial, and telecom equipment where the board stack-up is fixed and the connector sees moderate cycle counts. The 0.335" (8.51 mm) insulation height provides clearance for board-edge routing and keeps the mated stack height within a typical 0.5" board-to-board envelope.
Mating Half and Footprint Fit
The 0.114" (2.90 mm) solder-tail length fits standard 0.062" PCBs; verify the board hole pattern matches the dual-row 0.100" grid before committing the BOM line.