Dubox 38-Position Receptacle — Board-to-Board Fit
Mating with the corresponding Dubox pin header (same pitch, same row count) gives a reliable, push-pull connection for parallel board stacks. Insulation height is 0.335" (8.51mm) — factor this into the board-to-board standoff budget when selecting the mating header stack height.
Tin is a workhorse finish for moderate-cycle applications — expect several hundred mating cycles before wear-through, depending on insertion force and environment. The tin-on-tin interface is cost-effective for assemblies that mate infrequently (e.g., during manufacturing or field service every few years). In high-vibration or repeated-mating scenarios, a gold-plated sibling is the better call.