Product Introduction
Rated 5 A per contact at 110 V, with 30.0 µin (0.76 µm) gold or GXT™ plating on the mating surface for corrosion resistance over repeated insertion cycles.
Key Specs and Fit
The 0.100" pitch and 0.100" row spacing match the industry-standard 0.025" square pin grid — the same footprint used across the BERGSTIK II family. The 0.170" (4.32 mm) solder tail suits through-hole boards up to about 0.062" thick; the overall contact length of 0.588" (14.94 mm) sets the board-to-board stack height when mated with a matching vertical receptacle.
No official successor part number is on record. For a BOM that requires this exact footprint and pinout, a broker or surplus channel quote is the standard path.
Build-to-Print Checklist
This is a male pin header only — the mating half is a separate BOM line. For a complete board-to-board or wire-to-board interconnect, order the matching BERGSTIK II receptacle housing and crimp terminals (sold separately).