The Amphenol ICC 87900-118HLF is an 18-position, dual-row unshrouded male header from the BERGSTIK® II series. It uses the standard 0.100" (2.54 mm) pitch — the same spacing as legacy DIP packages and perfboard — so the board footprint is a straightforward 2 x 9 grid. Rated 5 A per contact at 110 V, this is a signal-level interconnect for board-to-board or wire-to-board duty through a mating IDC socket or crimp receptacle. The 30.0 µin gold plating on the mating surface gives it the mating cycle life for field-service or programming-header applications where the connector sees repeated connects and disconnects.
What the ratings mean for the fit
The 0.100" pitch is the key footprint dimension — it matches standard 0.100" header receptacles and allows the header to sit on a 0.100" grid. The 0.720" mating pin length gives plenty of wipe for a standard IDC socket or crimp housing. The unshrouded design means the pins are fully exposed; there is no keying or polarization shroud, so the mating connector orientation must be verified by the assembler. The 30.0 µin gold is a proper industrial thickness — this header will tolerate hundreds of mating cycles without the contact resistance drift you get from tin-plate fretting.