It sits on a 0.100" (2.54 mm) pitch with a matching 0.100" row spacing, making it a standard-density board-to-board interconnect for parallel PCB stacking or wire-to-board harnesses via a mating receptacle. The contacts are male square pins in phosphor bronze, plated with 30.0 µin (0.76 µm) gold or Gold, GXT™ on the mating surface — the 30 µ" thickness supports repeated mating cycles without exposing the base metal, suited for field-serviceable or production-test interfaces.
For a 24-position header, that gives a theoretical total of 120 A if every circuit is loaded, but the practical limit is set by the temperature rise across the full bundle and the PCB trace width feeding each pin.
The through-hole solder tails measure 0.120" (3.05 mm) long, and the overall contact length is 0.940" (23.88 mm) with a 0.720" (18.29 mm) mating section.