It uses a 0.100" (2.54 mm) pitch on both rows and contacts, which matches the standard DIP footprint — board layout engineers can drop this into a 0.100" grid without surprises. The through-hole solder termination and UL94 V-0 black housing suit it for general-purpose board-to-board interconnects inside enclosed equipment.
The 0.100" pitch and 0.100" row spacing give a 0.100" x 0.100" grid — the same footprint as a standard DIP socket or perfboard. The 0.720" mating pin length provides enough reach for a standard box header or IDC receptacle, and the 0.120" solder post suits a 0.062" to 0.093" PCB thickness.