The Amphenol BERGSTIK II 87900-152HLF is a 52-position dual-row unshrouded male header on 0.100" (2.54 mm) pitch — a standard-density board-to-board interconnect for through-hole soldering. Rated 5 A per contact at 110 V, this header suits signal-level interconnects where the current per line stays under the 5 A ceiling — the limiting factor is the pin density and the UL94 V-0 black housing's temperature rise, not the contact itself.
The 0.100" (2.54 mm) pitch and 0.100" (2.54 mm) row spacing define a standard 0.100" x 0.100" grid footprint — the same pattern used across the BERGSTIK II family, so the board layout is interchangeable with other 52-position dual-row headers in the series. The 0.720" (18.29 mm) mating contact length gives a deep wipe for reliable connection, and the 0.120" (3.05 mm) solder post length suits standard 0.062" to 0.093" PCB thicknesses.