Board-to-Board Header for Dense Parallel Interconnects
It uses a 0.100" (2.54mm) square-pin grid on both the mating pitch and row spacing, which matches the standard footprint for legacy and current-generation PCB layouts. Rated for 5A per contact at 110V, this header handles moderate power distribution on the same bus as signal lines — the 30.0µin gold or GXT™ plating on the mating surface gives it the cycle life for repeated board separation in test or field-service scenarios.
The 0.100" pitch and row spacing set the PCB land pattern — this is the standard 2.54mm grid used across the BERGSTIK and compatible families, so a board laid out for a legacy 64-pin header accepts this part without a footprint change. The 5A per-contact rating is derated from the UL94 V-0 housing's temperature rise limit.