The Amphenol FCI 87900-166HLF is a 66-position, dual-row unshrouded header from the BERGSTIK® II series, on a standard 0.100" (2.54 mm) pitch grid. It is a board-to-board interconnect intended for through-hole solder termination to a PCB, mating with a matching receptacle or socket strip. The 0.100" (2.54 mm) row spacing mirrors the pitch, keeping the footprint on a standard 0.100" grid — a layout that matches legacy and current PCB designs. The 0.720" (18.29 mm) mating contact length and 0.120" (3.05 mm) solder post length suit a range of board thicknesses and mating heights.

Amphenol FCI 87900-166HLF BERGSTIK II Header, 66 Pos
MPN87900-166HLF
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Amphenol FCI BERGSTIK® II, Board to Board, Header, 66 Positions, 0.100" (2.54mm) Pitch, 2 Rows, Through Hole, Solder, Gold 30.0µin.
$5.8543Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
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Independent supplier — new & surplus connector stock· Listing updated Aug 2026
Specifications
| Parameter | Value |
|---|---|
| Series | BERGSTIK® II |
| Type | Male Pin |
| Mounting | Through Hole |
| Connector type | Header |
| Fastening type | Push-Pull |
| Voltage rating | 110V |
| Current rating | 5A |
| Contact material | Phosphor Bronze |
| Insulation color | Black |
| Insulation height | 0.100\" (2.54mm) |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
All specifications
| Parameter | Value |
|---|---|
| Package | Bag |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 66 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact length - post | 0.120\" (3.05mm) |
| Overall contact length | 0.940\" (23.88mm) |
| Contact finish - mating | Gold or Gold, GXT™ |
| Contact length - mating | 0.720\" (18.29mm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Product details
Frequently asked questions
What is the pitch of the 87900-166HLF header?
The 87900-166HLF uses a 0.100" (2.54 mm) pitch on both the pin-to-pin spacing and the row-to-row spacing, matching the standard 0.100" grid for PCB footprints.