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87900-166HLF — Amphenol product photo

Amphenol FCI 87900-166HLF BERGSTIK II Header, 66 Pos

MPN87900-166HLF
Active

Amphenol FCI BERGSTIK® II, Board to Board, Header, 66 Positions, 0.100" (2.54mm) Pitch, 2 Rows, Through Hole, Solder, Gold 30.0µin.

$5.8543Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
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Specifications

87900-166HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions66
Row spacing - mating0.100\" (2.54mm)
Contact length - post0.120\" (3.05mm)
Overall contact length0.940\" (23.88mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating0.720\" (18.29mm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

The Amphenol FCI 87900-166HLF is a 66-position, dual-row unshrouded header from the BERGSTIK® II series, on a standard 0.100" (2.54 mm) pitch grid. It is a board-to-board interconnect intended for through-hole solder termination to a PCB, mating with a matching receptacle or socket strip. The 0.100" (2.54 mm) row spacing mirrors the pitch, keeping the footprint on a standard 0.100" grid — a layout that matches legacy and current PCB designs. The 0.720" (18.29 mm) mating contact length and 0.120" (3.05 mm) solder post length suit a range of board thicknesses and mating heights.

Frequently asked questions

What is the pitch of the 87900-166HLF header?

The 87900-166HLF uses a 0.100" (2.54 mm) pitch on both the pin-to-pin spacing and the row-to-row spacing, matching the standard 0.100" grid for PCB footprints.