68-Position BERGSTIK II Header for Dense Board-to-Board Interconnect
At a 0.100" (2.54mm) pitch, it matches the standard footprint used across legacy and current PCB designs — no board layout change needed for a drop-in. Rated 5 A per contact at 110 V, it handles typical signal-level current; the 68-pin density means the practical limit per row is set by the temperature rise of the housing, not the contact itself. The mating surface carries 30.0 µ" (0.76 µm) of gold or Gold GXT™ plating — enough for repeated mating cycles in field-service or test applications without fretting corrosion. The through-hole termination (0.120" post length) provides a solder joint that handles board flex better than an SMT equivalent. Insulation height is 0.100" (2.54mm), keeping the header profile low on the board.
The 0.100" pitch and 0.100" row spacing are industry-standard — the footprint accepts a matching receptacle from any manufacturer that follows the same grid. The 0.720" mating contact length gives plenty of wipe for reliable connection even with slight board misalignment. The 5 A per-contact rating is per the spec table; in a 68-position header, the total current through the connector is limited by the temperature rise of the black UL94 V-0 housing, not the individual pin rating. For sustained high-current on multiple adjacent pins, derate per the manufacturer's curve. The 30 µ" gold or GXT plating is the key differentiator from tin-plated siblings. Gold handles 200+ mating cycles without degradation; tin would gall and oxidise after 20-30 cycles. If your application is a one-time install with no field disconnect, a tin-plated BergStik header saves cost. For test points, programming headers, or any connector that gets unmated more than a few times, this gold-plated version is the correct choice.
The through-hole termination requires a 0.120" post length clearance on the solder side.