The Amphenol 87900-170HLF is a 70-position, dual-row unshrouded header from the BERGSTIK® II series, built on the standard 0.100" (2.54 mm) pitch grid. It is a board-to-board interconnect with through-hole solder termination, male square pins, and a push-pull fastening style. The 70 positions are fully loaded across two rows with a row spacing of 0.100" (2.54 mm), giving a 35-per-row layout that matches a standard 0.100-inch footprint for prototyping or production boards. The overall contact length is 0.940" (23.88 mm), with a mating length of 0.720" (18.29 mm) and a solder post length of 0.120" (3.05 mm) — the post length is the dimension that sets the through-hole standoff and solder fillet height on the board.
Mating and Board Layout Fit
As an unshrouded header, the 87900-170HLF mates with a standard 0.100-inch pitch IDC socket or a dual-row receptacle that accepts the 0.720" mating pin length. The 2.54 mm pitch and 2.54 mm row spacing mean the footprint is a simple 0.100-inch grid — two rows of 35 plated through-holes at 0.100" centers, with the rows spaced 0.100" apart. The 0.120" post length is short enough to clear a standard 1.6 mm PCB without bottom-side interference, but confirm the board thickness and solder wave clearance if the board is thicker than 2.4 mm.