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87900-408HLF — Amphenol product photo

87900-408HLF BergStik II Header, 8 Pos, 0.100" Pitch, 5A

MPN87900-408HLF
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FCI Amphenol BergStik® II, 8 Position, 0.100" (2.54mm) Pitch, 2 Row, Unshrouded, Through Hole, Tin, 5A.

$1.5300Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
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Specifications

87900-408HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions8
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.120\" (3.05mm)
Overall contact length0.940\" (23.88mm)
Contact finish - matingTin
Contact length - mating0.720\" (18.29mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

The FCI Amphenol 87900-408HLF is an 8-position, dual-row unshrouded header from the BergStik® II series, on the standard 0.100" (2.54mm) pitch. The tin-plated square pins are rated 5A per contact at the stated voltage of 110V. This is a workhorse general-purpose header for PCB stacking or wire-to-board via a matching receptacle — the unshrouded design keeps the footprint compact and the cost low, but provides no keying or polarization.

The 0.100" (2.54mm) pitch matches the standard DIP IC footprint — this header lands on a 2.54mm grid, so the PCB layout is straightforward but the routing density is limited to one trace between pads on a typical two-layer board. The 5A per-contact rating is fine for signal-level power and low-current I/O, but the tin-on-tin contact interface (100.0µin (2.54µm) on the mating side) means the mating cycle life is lower than gold-plated alternatives — this is a cost-optimized part for one-and-done or low-cycle-count assemblies, not for repeated field servicing. For a bench-level prototype or a fixed harness where the connector pair is aligned by the enclosure, this is fine. For a blind-mate or high-vibration application, a shrouded header would be the safer call.

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