The 87900-422HLF is a 22-position, dual-row unshrouded header from the BERGSTIK® II series, designed for board-to-board stacking applications. It uses a 0.100" (2.54 mm) pitch with matching row spacing, making it a standard footprint for prototyping and production runs. The through-hole solder termination and square male pins suit wave-solder assembly lines. Rated at 5 A per contact with a 110 V voltage limit, this header handles moderate signal and low-power duty. The 100.0 µ" tin plating on the mating surface provides good corrosion resistance for a limited number of mating cycles — typical for a permanent or infrequently serviced board-to-board interconnect. The black UL94 V-0 rated housing and phosphor bronze contacts are standard for equipment inside enclosures. The unshrouded design means no polarization or keying — the mating receptacle must align the pins correctly during assembly.
Sourcing and Lifecycle
No official cross-reference or direct substitute is listed. The BERGSTIK® II series includes multiple position counts and plating options; confirm the BOM position count and mating half before committing.
Board Layout Fit
The 0.100" pitch and row spacing define a standard 0.100" x 0.100" grid footprint. The overall contact length of 0.940" (23.88 mm) with a 0.720" mating length and 0.120" post length sets the board-to-board stack height — verify the mating receptacle's insulation height to ensure the pins engage fully. All 22 positions are loaded, so the footprint is a full 2x11 grid. The through-hole termination requires drilled and plated holes matching the 0.025" square pin cross-section.