It uses 0.100" (2.54 mm) pitch on both rows and between rows, making it a standard footprint for general-purpose board-to-board stacking. The square male pins are tin-plated on both the mating surface and the solder tails, with a 100.0 µ" (2.54 µm) thickness on the mating side — adequate for moderate mating cycles in clean, controlled environments like consumer electronics or industrial control boards.
Rated 5 A per contact. The 0.100" pitch and 0.720" (18.29 mm) mating pin length are sized for parallel board stacking.
This unshrouded header mates with any standard 0.100" pitch, dual-row IDC socket or crimp receptacle that accepts 0.025" square pins — common across the BERGSTIK and similar industry-standard families.