It uses a standard 0.100" (2.54mm) pitch on both rows and between rows, which means it drops onto a 0.100" grid footprint — no custom pad layout needed. With 30.0µin (0.76µm) gold plating on the mating surface, this header supports repeated mating cycles and holds up in mildly corrosive environments better than a tin-plated equivalent.
The key selection parameter is the position count — match it exactly to the BOM circuit count. The 0.100" pitch and 0.100" row spacing are standard across the series, so the footprint is shared; only the pin count and overall length change. The 30.0µin gold plating is the thicker option in the BERGSTIK II line — the standard is often 15.0µin or tin — so this variant is the one to pick for applications requiring higher mating cycle life or field-service reliability.
The 0.820" (20.83mm) mating pin length gives good reach into a standard receptacle — enough to clear a shrouded housing if one is used. The 0.120" (3.05mm) solder post length suits a standard 0.062" to 0.093" PCB thickness.