70-Position BERGSTIK II Header for High-Density Board-to-Board Interconnects
With a 0.100" (2.54 mm) pitch and 0.100" row spacing, it fits the standard 2.54 mm grid footprint used across legacy and current PCB layouts. The 30.0 µin (0.76 µm) gold plating on the mating surface provides the contact durability needed for repeated mating cycles and operation in mildly corrosive environments, while the phosphor bronze contact material offers good spring properties for consistent normal force over the life of the connection. The unshrouded design exposes the full 0.820" (20.83 mm) mating pin length, which is typical for stacking headers where the mating receptacle provides the polarization and the header pins are accessible for probing or test points. The through-hole solder termination with a 0.120" (3.05 mm) post length suits standard wave-solder assembly, and the UL94 V-0 rated black insulation meets the flame-retardancy requirement for equipment inside an enclosure.