72-Position BERGSTIK II Header for Board-to-Board Interconnects
It uses the standard 0.100-inch (2.54 mm) pitch on both the pin-to-pin and row-to-row spacing, making it a drop-in fit for legacy 0.100-inch grid prototyping and production boards.
The 72 positions loaded all means the BOM line must match exactly — a 72-circuit female socket or IDC connector is required. The 0.100-inch pitch and dual-row layout produce a board footprint 3.600 inches long (72 × 0.100" / 2). The overall contact length of 1.040 inches (26.42 mm) with a 0.820-inch (20.83 mm) mating length and 0.120-inch (3.05 mm) solder tail gives a tall through-hole profile; verify board clearance and the mating connector's insulation height (0.100 inches on the header side) to avoid interference. In a 72-position header, the practical derating for simultaneous current through adjacent pins is significant — treat it as a signal-level interconnect unless you are distributing power across multiple pins in parallel. The tin mating finish, while thick at 100.0 µin, will oxidize over time and is not rated for frequent mating cycles; gold-plated siblings in the BERGSTIK II family are the better choice for field-service or repeated disconnect applications.