It's a board-to-board interconnect, through-hole soldered, on the standard 0.100" (2.54 mm) pitch that matches a huge installed base of IDC sockets and female headers. The mating finish is specified as gold or Gold, GXT™ at 30.0 µin (0.76 µm) — that thickness buys you repeated mating cycles without contact fretting, which matters if this header lives in a board that gets swapped or reworked.
The 0.100" pitch is the classic DIP-compatible grid — your board footprint is a straight row of six plated-through holes on 2.54 mm centers. The 110 V rating gives adequate creepage for low-voltage logic and control circuits. The 0.830" (21.08 mm) mating pin length gives plenty of wipe for a standard box or IDC receptacle.