It uses a 0.100" (2.54mm) pitch, making it a standard footprint for prototyping and production board-to-board or wire-to-board interconnects where a mating IDC socket or crimp housing is used. The through-hole solder termination and square pins suit wave-solder assembly, and the 30.0µin (0.76µm) gold plating on the mating surface provides good corrosion resistance for moderate mating-cycle applications.
The 5A per-contact rating at 110V is typical for a signal-level header at this pitch — the current capacity is limited by the single-row density and the 0.100" (2.54mm) insulation height, not the contact itself.