Amphenol ICC (FCI) Dubox™ 89883-320LF, 40-position dual-row board-to-board receptacle, 0.100" (2.54mm) pitch, 30.0µin gold mating finish, through-hole right-angle termination, UL94 V-0 glass-filled thermoplastic housing, blue insulation.
| Parameter | Value |
|---|---|
| Series | Dubox™ |
| Gender | Female Socket |
| Mounting type | Through Hole, Right Angle |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Blue |
| Insulation height | 0.230\" (5.85mm) |
| Insulation material | Thermoplastic, Glass Filled |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
| Package | Tube |
| Termination | Solder |
| Applications | Automotive, General Purpose, Industrial, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 40 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.114\" (2.90mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
With 40 circuits in two rows at 0.100" pitch, the board footprint occupies a 2.00" row length (40 × 0.100" / 2 rows). The 0.114" solder post length sets the PCB hole depth — standard 0.062" boards with 0.100" plated through-holes accept this without issue. In high-vibration environments, a secondary retention method (board-mount screws or adhesive) should be evaluated.
The part is supplied in tube packaging.
Design engineers need to validate PCB footprint and clearance before layout.
Sourcing buyers need to quickly find a distributor with inventory to avoid BOM delays.
Budget and schedule planning for procurement require accurate pricing and delivery estimates.
Compatibility with matching headers is critical for board-to-board connection integrity.
Brokers and buyers need lifecycle status to avoid last-time buy risks or redesign.
Industrial and automotive applications require parts rated for specific thermal environments.