Board-to-Board Stacking with a Known Z-Height
Pitch is 0.100" (2.54 mm) on both the row and position spacing, so the footprint matches standard 0.100" header strips and the routing density is predictable — two traces between pads on a typical 2-layer board. The mating contacts are gold-plated to 30.0 µinch (0.76 µm) over phosphor bronze — this thickness supports 500+ mating cycles in a field-service or test-fixture application where the connector sees repeated engagement. Termination is surface-mount solder; the post finish is tin (78.7 µinch / 2.00 µm) for good wetting during reflow, and the housing is glass-filled thermoplastic rated UL94 V-0 for flame retardance inside equipment enclosures.