It carries 30.0 µ" (0.76 µm) gold or GXT™ plating on the mating surface, rated for 5 A per contact at 110 V — the gold thickness supports repeated mating cycles without the contact resistance drift you'd see with tin on a frequently serviced board pair.
The 0.100" (2.54 mm) pitch is the standard 0.1-inch grid that matches common perfboard and protoboard layouts, and the 0.900" (22.86 mm) mating pin length gives you a generous stack height between boards — useful when you need clearance for components on the underside of the top board. The through-hole solder tails are 0.225" (5.72 mm) long, which seats well in a standard 0.062" board without bottoming out.