It carries a 0.100" (2.54mm) mating pitch in a single row, with all positions loaded. The 30.0µin (0.76µm) gold or gold GXT™ plating on the mating surface supports repeated mating cycles without contact degradation — a practical choice for assemblies that see periodic board swaps or field service.
Fit and Footprint
The 0.100" pitch is the de facto standard for breadboard and prototyping layouts, but it also matches legacy 2.54mm grid designs. The overall contact length of 1.225" (31.12mm) breaks down as a 0.900" (22.86mm) mating pin and a 0.225" (5.72mm) solder post — the post length gives good through-hole fill on a standard 0.062" board. The 0.100" (2.54mm) insulation height leaves clearance for traces under the header body. For production runs where mis-mating risk is low (e.g., single-row, single-position orientation), this keeps the board footprint smaller and the cost down. If vibration or blind-mating is expected, a shrouded sibling in the same pitch is worth a look.