Board-to-Board Pin Header for Standard-Density Interconnects
It uses a 0.100" (2.54 mm) pitch — the standard spacing that matches legacy DIP footprints, IDC ribbon-cable receptacles, and perf-board layouts. The through-hole termination with a 0.225" (5.72 mm) post length suits wave-solder assembly on standard-thickness boards. The mating finish is 100.0 µ" (2.54 µm) of tin over phosphor bronze contacts — a thick layer that resists corrosion in indoor, low-cycle environments.
The 0.100" (2.54 mm) pitch is the first check — it sets the board footprint and the mating receptacle pitch. If your BOM calls for a 0.100" IDC socket or a BergStik-compatible receptacle, this header is a direct match. The 26 positions are loaded fully (all positions populated), so the pin count matches the circuit count exactly — no depopulated positions to account for. The tin-on-tin contact interface is cost-effective for one-time or infrequent mating (e.g., a factory-programmed board that ships as an assembly), but it will fret and oxidize under repeated field mating cycles.