3-Position SMD Receptacle at 0.100" Pitch
The post finish is 78.7 µinch tin — standard for solder joint reliability on the PCB. Mated stacking height is 10.81 mm, which sets the z-height between parallel boards in a mezzanine stack.
Surface-mount termination — the SMD pads are reflow-soldered to the PCB. The connector accepts bottom or top entry, meaning the mating header can approach from either side of the PCB — useful for mezzanine or board-to-board stacking where the orientation is fixed by the enclosure.
Application Range
The 30 µinch gold contacts suit environments with moderate vibration or humidity, though the push-pull retention means it is not a locking connector for high-shock installations.