16 Positions, Single Row, 2.54 mm Pitch
The 91601-316ALF: The single row keeps the board-edge width narrow, so it fits tight layouts where a dual-row would crowd adjacent components. Mated stacking height is 10.81 mm, which sets the board-to-board spacing for mezzanine or parallel stacking applications. The surface-mount solder tails are compatible with standard reflow profiles, and the pick-and-place feature means the reel can feed directly into an SMT line without hand placement.
Gold Mating Surface and 30 µinch Plating
Insulation height of 0.275" (6.99 mm) provides enough standoff for cleaning flux residue after reflow.
Board-to-Board Style for Automotive and Industrial Use
The connector is listed as a Board-to-Board style with a push-pull fastening type, meaning it is designed for blind-mate or tool-less mating where a latch is not required.