91615-322LF
Amphenol FCI Dubox 91615-322LF, 44-Position, 0.100" SMT Board-to-Board
MPN91615-322LF
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Amphenol FCI Dubox 91615-322LF board-to-board receptacle, 44 positions dual-row at 0.100" (2.54mm) pitch, surface-mount termination, gold-plated mating contacts with tin solder posts, 10.81mm mated stacking height, push-pull fastening with board-lock feature, UL94 V-0 thermoplastic, tube packaging.
$4.1633Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Jul 2026
Specifications
| Parameter | Value |
|---|---|
| Series | Dubox™ |
| Type | Female Socket |
| Mounting | Surface Mount |
| Connector type | Receptacle, Bottom or Top Entry |
| Fastening type | Push-Pull |
| Contact material | Phosphor Bronze |
| Insulation color | Gray |
| Insulation height | 0.275\" (6.99mm) |
| Insulation material | Thermoplastic, Glass Filled |
| Mated stacking heights | 10.81mm |
| Material flammability rating | UL94 V-0 |
| Style | Board to Board |
All specifications
| Parameter | Value |
|---|---|
| Package | Tube |
| Features | Board Lock |
| Termination | Solder |
| Applications | Automotive, General Purpose, Industrial, Telecommunications |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 44 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 30.0µin (0.76µm) |
Frequently asked questions
What does the 91615-322LF mate with?
It mates with the corresponding male header in the same Dubox 91615 base product series — a 44-position dual-row header at 0.100" (2.54mm) pitch with the matching row spacing and board-lock feature. Confirm the mating half's retention style and stack height before designing the board-to-board assembly.