22 Circuits, Dual-Row, 0.100" Pitch — Board-to-Board Mezzanine Fit
The 91618-311BLF: Mated stack height is 10.81mm, confirmed by the connector geometry. The solder tails receive a 78.7µinch tin finish for reliable solder joint formation.
Push-Pull Fastening, Top or Bottom Entry
The receptacle accepts top or bottom entry, so the same part works as the upper or lower half of the mezzanine pair. Insulation height is 0.275" (6.99mm), leaving clearance for components on the opposite board.
Application Range: Automotive, Industrial, Telecom
The 30µinch gold contacts and UL94 V-0 housing support the vibration and thermal cycling typical of industrial control panels and telecom infrastructure.