The 92417-106HLF is a 6-position, dual-row unshrouded header from the BergStik® II series by FCI (now Amphenol ICC). It's a board-to-board interconnect on the standard 0.100" (2.54mm) pitch and row spacing — the same footprint that's been a de facto standard in digital logic and industrial control boards for decades. The 5A per-contact rating and 30.0µin gold plating on the mating surface mean this header is specced for repeated mating cycles in controlled environments, not a one-time solder-and-forget joint.
What the ratings mean for the fit
The 0.100" pitch and row spacing are the critical board-layout dimensions — they match the industry-standard BergStik footprint, so any dual-row receptacle on the same pitch is a candidate mate. The 0.320" mating pin length gives enough reach for standard box headers and shrouded receptacles without bottoming out. The 5A per-contact rating is typical for signal-level duty; at this pitch and pin density, the current is limited more by the temperature rise of the unshrouded housing than by the contact itself. The 30.0µin gold on the mating side supports hundreds of mating cycles — well above the 50-cycle threshold where tin-plated contacts start fretting in low-voltage circuits.
The UL94 V-0 rated black housing and phosphor bronze contacts with gold plating make this a straightforward choice for board-level interconnect in industrial controllers, test equipment, and telecom line cards where the board stays inside an enclosure. The unshrouded design means the header sits low on the board — 0.100" insulation height above the PCB — which keeps the mated stack height tight for dense card cages.