It uses a 0.100-inch (2.54 mm) pitch on both rows and contacts, with a row spacing of 0.100-inch, making it a standard footprint for general-purpose board-to-board interconnects. As an unshrouded header, it relies on the mating receptacle for polarization and pin protection. It mates with standard 0.100-inch pitch shrouded headers or IDC receptacles that accept 0.025-inch square posts.
Fit and Compatibility
The 18 positions are loaded as a 2x9 dual-row configuration. The overall contact length of 0.530 inches (13.46 mm) includes a 0.320-inch (8.13 mm) mating length and a 0.110-inch (2.79 mm) solder post. These dimensions define the board-to-board stack height and the through-hole drill depth required for the solder tails. The square pin geometry (0.025-inch square post) is the industry standard for mating with crimp receptacle terminals and IDC sockets. The unshrouded design means the header itself offers no keying — polarization comes from the mating receptacle housing. For applications requiring vibration resistance or blind-mating guidance, a shrouded header from the same series would add those features at the same pitch and row spacing.