Board-to-Board Header for Dense Parallel Stacking
The Amphenol FCI 92417-166HLF is a 66-position, dual-row unshrouded header from the BERGSTIK® II series, designed for board-to-board stacking applications on the standard 0.100" (2.54mm) pitch grid. The 30.0µin (0.76µm) gold plating on the mating surface ensures consistent contact resistance over repeated mating cycles, making it suited for industrial control, test equipment, and telecom backplane connections.
The 0.100" pitch and matching 0.100" row spacing define a standard footprint that aligns with the legacy BergStik grid — board layout is straightforward and compatible with a wide range of BergStik II receptacles. Rated 5 A per contact at 110 V, this header handles general-purpose signal and moderate power distribution; the 30.0µin gold finish on the mating side supports hundreds of mating cycles in environments where tin contacts would fret or corrode.