Board-Level Header for Standard-Density Interconnects
Position and Pitch: Matching the BOM Line
With all 20 positions loaded across two rows at a 0.100" (2.54 mm) pitch, this header matches the footprint of a standard 20-pin IDC socket or a BERGSTIK II receptacle. The row spacing is also 0.100" (2.54 mm), giving a 0.100" x 0.100" grid that aligns with common perf-board and prototyping layouts.
