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92417-430HLF — Amphenol product photo

92417-430HLF BERGSTIK II Header, 30 Pos, 0.100" Pitch, 5A

MPN92417-430HLF
Active

FCI / Amphenol BERGSTIK® II, 92417-430HLF, Board to Board Header, 30 Positions, 2 Rows, 0.100" (2.54mm) Pitch, Through Hole, Solder Termination, Tin Mating Contact Finish, 5A, 110V.

$0.7784Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

92417-430HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions30
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.110\" (2.79mm)
Overall contact length0.530\" (13.46mm)
Contact finish - matingTin
Contact length - mating0.320\" (8.13mm)
Contact finish thickness - mating100.0µin (2.54µm)

Product details

The 92417-430HLF is a 30-position, dual-row unshrouded male pin header from the FCI / Amphenol BERGSTIK® II series, designed for board-to-board and wire-to-board interconnect applications on a standard 0.100" (2.54mm) pitch.

The 0.100" (2.54mm) pitch and 0.100" (2.54mm) row spacing define a standard grid that matches legacy DIP footprints and common perfboard layouts — the board layout engineer can route one trace between pads on a typical two-layer board without necking down. The 30 positions are loaded in two rows of 15, giving a 15 x 2 arrangement that occupies 1.500" of board edge per row. The 0.320" (8.13mm) mating pin length provides enough reach to mate with standard box headers or IDC receptacles, while the 0.110" (2.79mm) solder post length suits boards up to about 0.062" thick.

Compared to the 10-position single-row variant of the same series, the 92417-430HLF carries 30 positions across two rows at the same 0.100" pitch — the extra positions let you consolidate more signals onto one connector, reducing the component count on the BOM. The tin-on-tin contact interface (mating and post both tin) is the cost-optimized option within the series; gold-plated siblings exist for applications requiring higher mating cycle counts or better corrosion resistance in humid environments.

Frequently asked questions

What is the pitch of 92417-430HLF?

The 92417-430HLF has a 0.100" (2.54mm) pitch on both the mating and row spacing, matching the standard 0.100" grid footprint common to DIP packages and breadboard layouts.