Board-to-Board Header for Dense Parallel Interconnects
The FCI 92417-470HLF is a 70-position, 2-row unshrouded male pin header from the BERGSTIK® II series, designed for board-to-board stacking applications where a standard 0.100" (2.54mm) pitch footprint is required. Each square pin is phosphor bronze with 100.0µin (2.54µm) tin plating on the mating surface and tin on the solder post, rated for 5A per contact at 110V. UL94 V-0 rated black insulation handles the flammability requirements of enclosed equipment.
70 Circuits at 0.100" Pitch — Footprint and Routing
70 positions loaded across two rows at 0.100" (2.54mm) pitch with 0.100" (2.54mm) row spacing means a 35-pin-per-row layout spanning roughly 3.5 inches along the board edge. The 0.320" (8.13mm) mating pin length provides enough reach to engage a standard box-type receptacle, while the 0.110" (2.79mm) post length suits a typical 0.062" to 0.093" PCB thickness with through-hole solder fillet.
Tin Plating — Mating Cycle and Environment
The 100.0µin (2.54µm) tin-on-tin contact interface is a heavy plating grade — thicker than the 15-30µin flash tin common on low-cost headers. This thickness handles repeated mating cycles better than flash tin, making the 92417-470HLF a reasonable choice for modular board assemblies that see periodic reconfiguration or test-fixture duty. Tin-to-tin contacts do require a minimum normal force to maintain a gas-tight junction; the square pin profile in a standard box receptacle provides that wipe. For corrosive or high-humidity environments, a gold-plated sibling would be the alternative — but the tin plating here is perfectly serviceable in clean, indoor, climate-controlled equipment.