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92634-156HLF — Amphenol product photo

FCI 92634-156HLF BergStik II Header, 56 Pos, 0.100" Pitch

MPN92634-156HLF
Active

FCI BergStik® II, 56 position, 0.100" (2.54 mm) pitch, through-hole right-angle unshrouded header, 5 A per contact, 30 µ" gold plating.

$4.1909Ref. price · indicative, final on quote
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

92634-156HLF Technical Specifications
ParameterValue
SeriesBERGSTIK® II
GenderMale Pin
Mounting typeThrough Hole, Right Angle
Connector typeHeader
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.190\" (4.83mm)
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageBag
ShroudingUnshrouded
TerminationSolder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions56
Row spacing - mating0.100\" (2.54mm)
Contact length - post0.318\" (8.08mm)
Contact finish - matingGold or Gold, GXT™
Contact length - mating0.318\" (8.08mm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

The FCI 92634-156HLF is a 56-circuit, dual-row unshrouded male pin header from the BergStik® II series, one of the most widely used 0.100" (2.54 mm) pitch pin header families in the industry. Rated 5 A per contact with 30.0 µ" (0.76 µm) gold on the mating surface, this header is built for repeated mating cycles and moderate environmental exposure — the gold layer prevents oxidation on the contact interface better than a tin finish would. The through-hole right-angle termination places the solder tails parallel to the board, which is the typical orientation for a mezzanine or wire-to-board connection where the cable exits the board edge.

For a power distribution application, derate per the manufacturer's curve or limit the number of active pins carrying full current.

Plating and Contact Reliability

The 30.0 µ" (0.76 µm) gold over phosphor bronze contact material is a solid choice for applications requiring 200+ mating cycles or exposure to mildly corrosive environments (industrial cabinets, telecom racks). The gold thickness is well above the 15 µ" minimum that most connector engineers consider the threshold for reliable low-level signal switching. For a one-time permanent solder connection, a tin-plated version would be cheaper, but the gold here gives you field-service flexibility — the header can be unmated and remated without the contact resistance creep that tin-on-tin interfaces develop after a few cycles.

The through-hole solder tails fit a standard plated through-hole.

Frequently asked questions

Where can I buy 92634-156HLF and is it available via RFQ confirmation?

Contact the storefront with your BOM quantity for a same-day quote.

What is the pitch of the 92634-156HLF?

The 92634-156HLF has a 0.100" (2.54 mm) mating pitch with the same 0.100" row spacing, matching the standard BergStik II footprint.

Is the 92634-156HLF a shrouded or unshrouded header?

It is an unshrouded header — the pins are exposed with no plastic shroud around them, so the mating receptacle must be aligned correctly by the board layout.