Rated 5 A per contact at 110 V, it carries 30.0 µ" (0.76 µm) gold on the mating surface — enough plating for repeated board-to-board mating cycles without contact fretting.
The 0.100" pitch and 0.100" row spacing define a standard 0.100" x 0.100" grid footprint — the same as legacy DIP or IDC patterns. The 70 positions fill a 35-position-per-row layout, so the board footprint is 3.500" long across the mating face. The right-angle orientation means the post length (0.318" / 8.08 mm) determines how far the header sits off the board edge; the insulation height of 0.190" (4.83 mm) is the clearance above the PCB for components underneath.
Termination is solder to through-hole — the 0.318" post length suits standard 0.062" to 0.093" PCBs. All 70 positions are loaded.