It uses 0.100" (2.54 mm) square pins on the same pitch for both rows, giving a standard 0.100" x 0.100" grid that matches common prototyping and production footprints. With a 5 A per-contact rating and full tin plating at 100 µ" on the mating surface, this header handles signal and moderate power duty in dry, low-vibration environments.
The 0.100" pitch and row spacing define a 0.100" x 0.100" pin grid — a standard footprint that matches a wide range of dual-row receptacles and IDC sockets. The 0.318" mating pin length gives enough reach to engage a standard box-header or socket housing, while the 0.318" post length provides a solid through-hole solder joint on a typical 0.062" board.
Contact finish and duty
Full tin plating at 100 µ" on the mating surface gives good corrosion resistance and handles moderate mating cycles — think production-level board interconnects or test fixtures that see tens of cycles, not hundreds. The phosphor bronze base material provides spring retention in the mating contact.