It uses a 0.100" (2.54mm) pitch — the standard DIP footprint spacing — making it a drop-in for legacy through-hole layouts. Rated 5A per contact at 110V, the current capacity is typical for signal-level duty on a 0.100" pitch header — adequate for logic-level loads, I/O lines, and low-power distribution, but not a power bus. The tin-plated mating contacts are cost-effective for low mating-cycle applications; the 100.0µin (2.54µm) tin finish provides good corrosion resistance for permanent or semi-permanent harness connections where frequent disconnect is not required. The through-hole, right-angle mounting with 0.318" (8.08mm) solder tails provides mechanical retention in the board, and the UL94 V-0 rated black insulation suits equipment requiring flame-rated components inside an enclosure.
Positioning in the BERGSTIK II Series
The 92634-418HLF is the 18-position, dual-row, right-angle variant in the BERGSTIK II family. The 18-position version adds eight circuits for applications requiring more I/O in the same footprint class.