Board-to-Board Header, 42 Positions, Right-Angle
It uses a 0.100" (2.54 mm) pitch on both rows and contacts, making it a standard-density board-to-board interconnect for parallel or perpendicular PCB mating.
Both the mating surface and the solder post carry 100.0 µin (2.54 µm) of tin over phosphor bronze. The through-hole solder tails are 0.318" (8.08 mm) long.
Mechanical and Environmental Ratings
The insulation height is 0.190" (4.83 mm) above the board surface, which sets the mated stack height when paired with a receptacle. The 42 positions are all loaded — no empty pin locations to work around. The black insulation colour is standard for BERGSTIK II and helps with visual inspection of the mated pair.