Board-to-Board Header, 58 Positions, 2.54 mm Pitch
It uses a 0.100" (2.54 mm) pitch with matching row spacing, making it footprint-compatible with standard 2.54 mm grid layouts.
The 5 A per-circuit rating at 110 V is typical for a 2.54 mm pitch unshrouded header — the limiting factor in a dense dual-row layout is the temperature rise from all circuits under load, not the individual contact. Tin plating at 100.0 µ" (2.54 µm) on the mating surface gives a solid, cost-effective contact for moderate mating cycles (board-to-board stacking, not frequent reconnection). The 0.318" (8.08 mm) mating pin length and 0.318" post length provide enough standoff for a standard PCB stack — confirm the mated height against your board spacing.