Board-to-Board Header, 68 Positions, 0.100" Pitch
The FCI 92634-468HLF is a 68-position, dual-row unshrouded header from the BERGSTIK® II series, designed for board-to-board interconnect. It uses a 0.100" (2.54 mm) pitch on both the mating interface and the row spacing, which matches the standard 0.100" grid for prototyping and production layouts. The right-angle through-hole termination places the pins parallel to the PCB, suited for edge-mount or mezzanine stacking where the connector exits the board at 90 degrees. Tin plating is applied to both the mating contact surface (100.0 µin thickness) and the solder posts, with a phosphor bronze base material. The housing is rated UL94 V-0 for flame retardance.
What the Ratings Mean for Your Fit
The 0.100" pitch is the industry-standard breadboard spacing — it fits directly into perfboard or standard 0.100" header footprints without layout adjustment. The 68 positions, all loaded, match a 68-conductor ribbon cable or a 68-pin BOM line; the dual-row arrangement means 34 pins per row. The 5 A per-contact rating is typical for signal-level current; at this pitch and with tin plating, derate the current if ambient temperature exceeds the standard 25 °C or if multiple adjacent contacts carry full load simultaneously. The right-angle orientation requires a board edge or a keep-out zone for the 0.318" mating pin length extending beyond the PCB edge. Tin plating is adequate for moderate mating cycles (50–100 mates) in clean, indoor environments — not for high-vibration or corrosive conditions where gold would be specified.
Sourcing and Lifecycle
The 92634-468HLF carries an Active lifecycle status — the manufacturer has no end-of-life notice on this order code. No official successor or cross-reference is on record; the 68-position count and 0.100" pitch are the primary BOM matching criteria.