Board Fit and Stack Height for Mezzanine Routing
The 93289-140LF: Eighty circuits on a 1.27 mm dual-row grid — the board footprint demands tight trace routing between pads, but the 0.050" row spacing keeps the differential pair pitch manageable for high-density backplanes. Mated stack height is 8.26 mm, with the insulator standing 7.57 mm above the board. That z-height budget fits standard mezzanine card spacing in 1U enclosures. The shrouded 4-wall header includes a board guide to align the mating receptacle during blind-mate assembly — saves bent pins on the production line.
Current, Plating, and Temperature Envelope
The solder tail gets a 100 µinch tin finish for a reliable SMT joint. Operating range from -55°C to 130°C with a UL94 V-0 glass-filled thermoplastic housing. Suitable for outdoor telecom cabinets and industrial control where the ambient cycles through freezing to hot.