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93690-103-08LF — Amphenol product photo

Amphenol ICC 93690-103-08LF BERGSTIK Header, 8 Pos

MPN93690-103-08LF
Active

Amphenol ICC BERGSTIK® Series, Header Breakaway, 8 Positions, 2 Rows, 0.100" (2.54mm) Pitch, Through Hole, Press-Fit/Solder Termination, Gold GXT™ Mating Finish, 5A, 110V, UL94 V-0.

$0.5649Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
  • Photo-verified countsEvery line counted and photographed before the box closes.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

93690-103-08LF Technical Specifications
ParameterValue
SeriesBERGSTIK®
GenderMale Pin
Mounting typeThrough Hole
Connector typeHeader, Breakaway
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0
StyleBoard to Board or Cable
PackageBulk
ShroudingUnshrouded
TerminationPress-Fit, Solder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions8
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.177\" (4.50mm)
Overall contact length0.505\" (12.83mm)
Contact finish - matingGold, GXT™
Contact length - mating0.224\" (5.70mm)
Contact finish thickness - post39.4µin (1.00µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

Rated 5A per contact at 110V, with gold GXT™ plating at 30.0µin (0.76µm) on the mating surface and a tin post finish. The unshrouded, push-pull design means it snaps into a matching receptacle or can be left as a free-standing pin header for test points or programming headers.

Through-hole mounting with a dual termination option — press-fit or solder. The press-fit tail lets you assemble without wave solder in a backplane or high-reliability build where rework matters; the same footprint works for a standard solder wave if your line isn't set up for press-fit. Overall contact length is 0.505" (12.83mm), with a 0.177" (4.50mm) post length below the board. The insulation height sits at 0.100" (2.54mm) above the board surface — low profile enough for tight card-to-card spacing.

Plating and environment

UL94 V-0 thermoplastic housing, black. Rated for board-to-board or cable interconnect duty — the unshrouded pins let you route ribbon cable or discrete wires to a mating crimp housing, or plug directly into a female header on another board.

Frequently asked questions

Is 93690-103-08LF an active part or obsolete?

The 93690-103-08LF carries an Active lifecycle status per the manufacturer — full production, no end-of-life notice.

What is the exact pitch and row count of 93690-103-08LF?

0.100" (2.54mm) pitch in both the row-to-row and pin-to-pin spacing, with 2 rows and 8 positions total — all positions loaded.

What is the mounting type and termination style of 93690-103-08LF?

Through-hole mounting with a dual press-fit or solder termination option — the same footprint works for either process.