The Amphenol ICC BERGSTIK® 93690-103-20LF is a 20-position, dual-row breakaway header on a standard 0.100" (2.54 mm) pitch. The mating interface carries a Gold GXT™ finish at 30.0 µin (0.76 µm), while the solder posts are tin-plated at 39.4 µin (1.00 µm). The housing is black thermoplastic rated UL94 V-0.
Breakaway Design and Unshrouded Profile
As a breakaway header, the 93690-103-20LF ships as a full strip that can be snapped to the required position count — in this case 20 positions are loaded.
Termination and Mounting
The press-fit option uses a compliant pin that deforms to fill the plated through-hole without solder, common in backplane applications where rework or high-reliability solderless assembly is preferred. The solder option is straightforward wave-solder through-hole. The overall contact length is 0.505" (12.83 mm), with a mating length of 0.224" (5.70 mm) and a post length of 0.177" (4.50 mm) — these dimensions determine the board thickness and stack-up the header can accommodate.
Mating and Application
This unshrouded header mates with any standard 0.100" (2.54 mm) pitch dual-row receptacle housing that accepts square 0.025" (0.64 mm) male pins. Typical mating connectors include IDC sockets, crimp-to-wire receptacles, or other BERGSTIK receptacles from the same series. For wire-to-board applications, the header is the board-side component; the cable side uses a receptacle housing with crimp terminals.