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Amphenol 93690-103-48LF — Pin Headers, Sockets & Housings

Molex BERGSTIK 93690-103-48LF, 48-Pos Unshrouded Header, 5 A

MPN93690-103-48LF
Active

Molex BERGSTIK 93690-103-48LF, 48-position dual-row unshrouded header, 0.100" (2.54 mm) pitch, 5 A per contact, gold GXT mating / tin-plated post, through-hole press-fit and solder termination, UL94 V-0.

$2.9352Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Jul 2026

Specifications

93690-103-48LF key specifications
ParameterValue
SeriesBERGSTIK®
TypeMale Pin
MountingThrough Hole
Connector typeHeader, Breakaway
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

93690-103-48LF additional specifications
ParameterValue
StyleBoard to Board or Cable
PackageBag
ShroudingUnshrouded
TerminationPress-Fit, Solder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions48
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.177\" (4.50mm)
Overall contact length0.505\" (12.83mm)
Contact finish - matingGold, GXT™
Contact length - mating0.224\" (5.70mm)
Contact finish thickness - post39.4µin (1.00µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

48-Position Dual-Row Breakaway Header for Board-to-Board and Cable Interconnects

It carries a 0.100" (2.54 mm) pitch on both the mating and row spacing, matching the standard 0.100" grid for prototyping and production layouts. The 5 A per-contact figure is the current limit before the temperature rise reaches the ceiling of the UL94 V-0 thermoplastic housing. Contact plating is split: the mating surface carries 30.0 µ" (0.76 µm) of gold GXT, while the post is tin-plated at 39.4 µ" (1.00 µm). The tin-plated post is compatible with both solder and press-fit termination into standard plated through-holes.

Termination and Mounting: Press-Fit and Solder Flexibility

The press-fit option allows solderless assembly into plated through-holes — useful for backplane applications where rework or field replacement is expected. The solder option provides a conventional wave-solder joint for standard PCB assembly. The contact length — 0.224" (5.70 mm) mating, 0.177" (4.50 mm) post, 0.505" (12.83 mm) overall — fits standard 0.062" to 0.093" board thicknesses with room for the solder fillet.

Frequently asked questions

What is the pitch of 93690-103-48LF?

The pitch is 0.100" (2.54 mm) on both the mating and row spacing, matching the standard 0.100" grid.