It sits on a standard 0.100" (2.54 mm) pitch with matching 0.100" row spacing, making it footprint-compatible with the broad BERGSTIK ecosystem of receptacles and IDC connectors. The contact finish is split: gold GXT™ on the mating side at 30.0 µin (0.76 µm) thickness, tin on the solder post at 39.4 µin (1.00 µm). The tin post takes solder well in wave or selective-solder processes. Termination is listed as both press-fit and solder, through-hole mount. The press-fit option suits backplane or solderless assembly where rework matters; the solder tail gives a conventional wave-solder joint. The unshrouded, push-pull fastening means it mates with standard BERGSTIK receptacles without a locking ramp — fine for internal harnesses where vibration is controlled.
Board-to-Board or Cable — the Breakaway Advantage
It is listed for board-to-board or cable use — mate it with a BERGSTIK receptacle for mezzanine stacking, or with an IDC socket for ribbon-cable termination. The unshrouded profile keeps the footprint small, but leaves the pins exposed before mating.