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Amphenol 93690-403-24LF — Pin Headers, Sockets & Housings

Amphenol 93690-403-24LF BergStik Header, 24 Pos

MPN93690-403-24LF
Active

Amphenol BergStik® 93690-403-24LF, unshrouded breakaway header, 24 positions, 2 rows, 0.100" (2.54 mm) pitch, through-hole press-fit/solder termination, tin-plated contacts, UL94 V-0.

$1.6352Ref. price · indicative, final on quote
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent China distributor & sourcing agent· Listing updated Aug 2026

Specifications

93690-403-24LF key specifications
ParameterValue
SeriesBERGSTIK®
TypeMale Pin
MountingThrough Hole
Connector typeHeader, Breakaway
Fastening typePush-Pull
Voltage rating110V
Current rating5A
Contact materialCopper Alloy
Insulation colorBlack
Insulation height0.100\" (2.54mm)
Insulation materialThermoplastic
Material flammability ratingUL94 V-0

All specifications

93690-403-24LF additional specifications
ParameterValue
StyleBoard to Board or Cable
PackageBag
ShroudingUnshrouded
TerminationPress-Fit, Solder
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions24
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact length - post0.177\" (4.50mm)
Overall contact length0.505\" (12.83mm)
Contact finish - matingTin
Contact length - mating0.224\" (5.70mm)
Contact finish thickness - post120.0µin (3.05µm)
Contact finish thickness - mating120.0µin (3.05µm)

Product details

BergStik Breakaway Header, 24 Positions, 0.100" Pitch

The Amphenol 93690-403-24LF is a 24-position member of the BergStik® series, a family of unshrouded breakaway headers built on the standard 0.100" (2.54 mm) pitch grid. This is a dual-row header with the same 0.100" row spacing, giving you a 12 x 2 pin array that fits the classic 0.100 x 0.100-inch PCB footprint. Termination is listed as both press-fit and solder, meaning the same through-hole header can be pressed into plated holes for a solderless backplane assembly or wave-soldered in a conventional build.

If your board already has a 0.100 x 0.100-inch header footprint, this part drops in. The 24 positions give you 12 pins per row, which is a common count for parallel data buses or multi-wire harnesses. This matters if the board sees humidity or mild condensation — tin-to-tin interfaces are stable in those conditions, though they don't match the cycle life of gold. For a breakaway header that may be depopulated and re-mated during prototyping, the heavy tin layer gives decent wear resistance before oxidation becomes an issue.

Frequently asked questions

What is the closest pin-compatible alternative to the 93690-403-24LF in the BergStik family?

Within the BergStik series, the closest alternatives are other 24-position, dual-row, 0.100-inch pitch breakaway headers with the same footprint. The key differentiators are contact plating (tin vs gold) and termination style (press-fit vs solder only). The 93690 base number covers variants with gold-plated mating surfaces for higher cycle life; check the full 93690 family for those options.