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93696-323LF
Amphenol

93696-323LF Dubox 46-Position Board-to-Board Receptacle

MPN93696-323LF
Active

Amphenol ICC (FCI) Dubox™ 93696-323LF, 46-position dual-row board-to-board receptacle, 0.100" (2.54 mm) pitch, female socket, phosphor bronze contacts, gold mating (0.76 µm) / tin post (2.00 µm), through-hole, push-pull, bottom or top entry, UL94 V-0 glass-filled thermoplastic, gray insulation.

$5.4096Ref. price · indicative, final on quote
93696-323LF datasheet
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • New & original stockTraceable channels only — no mixed lots, no re-taped reels.
  • Factory packaging where availableSealed reels, trays and bags; cut quantities always stated on the quote.
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Specifications

93696-323LF Technical Specifications
ParameterValue
SeriesDubox™
GenderFemale Socket
Mounting typeThrough Hole
Connector typeReceptacle, Bottom or Top Entry
Fastening typePush-Pull
Contact materialPhosphor Bronze
Insulation colorGray
Insulation height0.275\" (6.99mm)
Insulation materialThermoplastic, Glass Filled
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageTube
FeaturesBoard Guide
TerminationSolder
ApplicationsAutomotive, General Purpose, Industrial, Telecommunications
Contact shapeSquare
Rows2
Pitch0.100\" (2.54mm)
Positions46
Row spacing - mating0.100\" (2.54mm)
Contact finish - postTin
Contact finish - matingGold
Contact finish thickness - post78.7µin (2.00µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

46-Position Dual-Row Receptacle for Board-to-Board Stacks

The 93696-323LF is a 46-position, dual-row board-to-board receptacle from the Amphenol ICC Dubox series.

With a 0.275" (6.99 mm) insulation height, the receptacle sits low on the board, keeping the mated stack height within a tight z-budget for mezzanine or card-edge applications. The dual-row, 46-position layout packs 23 contacts per row, which demands careful trace routing to avoid congestion between the two rows. The through-hole solder posts (tin finish, 2.00 µm thick) require plated through-holes in the PCB — the hole diameter and pad size must match the post dimensions from the product drawing to ensure reliable solder fillet formation.

The female socket contacts accept square pins from the mating header. The gold-on-gold interface (30 µinch on both sides) keeps contact resistance stable over the rated mating cycles.

Frequently asked questions

What is the pitch of 93696-323LF?

The mating pitch is 0.100" (2.54 mm), and the row spacing is also 0.100" (2.54 mm). This is a standard 2.54 mm grid, so the board footprint matches common dual-row header layouts.

Is 93696-323LF through-hole or SMD?

It is a through-hole (THT) component — the solder posts go through plated holes in the PCB. It is not surface-mount.